Bond Connect Anniversary Summit 2024

Bond Connect Anniversary Summit 2024
Innovating and Partnering for the Future

Date: Tuesday, 9 July 2024

Time: 9:00am – 5:30pm (HKT)

Format:  In-person/Virtual

Registration: Registration Link
(Due to venue limitations,  in-person registration will be given out on first come first serve basis.)

Location: HKEX Connect Hall, 1/F, One and Two Exchange Square, 8 Connaught Place, Central

Offical Website: Bond Connect Anniversary Summit 2024

Organiser:Bond Connect Company Limited
For general inquiries regarding registration and the event,  please contact

Language: English & Putonghua (Simultaneous interpretation available)

Event Brief

In the seven years since the launch of Bond Connect, continuous innovations, expansions and new initiatives, such as Swap Connect, have deepened market connectivity between the Mainland and Hong Kong and propelled the opening up of China’s financial markets.

Themed “Innovating and Partnering for the Future”, Bond Connect Anniversary Summit 2024 will take place on Tuesday, 9 July 2024 to celebrate the many milestones of the past year, where regulators, issuers, investors, and market participants from Mainland China and Hong Kong will share valuable insights covering the global macroeconomy, cross-border green and sustainable finance, China financial markets opening-up and China bond investment opportunities.

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